Au Bon Pain Sesame Breadstick
Dough [Enriched Flour (Wheat Flour, Malted Barley Flour, Niacin, Iron, Thiamin Mononitrate, Riboflavin, Folic Acid), Water, Dough Conditioner (Sugar, Salt, Malted Barley Flour, Contains 2% or less of Molasses, DATEM, Enzyme, Mono- and Di-glycerides, Potassium Iodate, Ammonium Chloride, Ascorbic Acid, L-Cysteine, Azodicarbonamide), Sugar, Yeast, Molasses, Soy Lecithin], Topping (Sesame Seeds).
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